Huawei decided not to depend on memory shortages and is preparing its own DRAM production

Huawei is reportedly moving to make its own DRAM rather than rely on outside vendors, industry sources say. The effort is a joint one with Chinese maker Swaysure and carries state support (govt. backing). The stated aim: blunt dependence on global memory suppliers and try to weather both chip shortages and any new U.S. trade curbs — though that's the intent, not a guarantee.

Planned build: a 12-inch (300 mm) fab, capacity up to 140,000 wafers/month. Initial output would target 28 nm DRAM (e.g., mature-node memory). For leadership, Huawei has hired an ex-TSMC director as the plant’s gen. dir. and brought in an ex-Elpida executive as strategic consultant.

A wrinkle: Huawei knows chips and design, but large-scale DRAM production is a different beast; Swaysure is expected to carry much of that manufacturing know‑how. Govt. involvement is meant to speed construction and lower some supply risks, while also bluntly addressing dependence on players such as Samsung, SK hynix, and Micron. Still, process complexity, yield ramp-up and market dynamics make this a long, uncertain road rather than a quick fix.

Sources: Wccftech